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我公司专业经营Assembleon MG-1用滚珠丝杆,直线导轨及滚珠丝杆

本公司专业销售Assembleon MG-1用滚珠丝杠,直线导轨等各类传动件,在贴片机行业有服务多台Assembleon MG-1经验,并针对Assembleon MG-1高精度贴片机设备备有大量丝杠,导轨库存,欢迎客户对Assembleon MG-1丝杠导轨采购及咨询。

 Thanks to a high precision single placement beam that carries eight independent Z-servo controlled heads, the MG-1R provides a perfect balance between chip and IC shooting. It is available in two versions: one with a Flying Nozzle Change (FNC) head for when many nozzle changes are needed and high output is important, the other with a Super Fine (SF) head for use with a wider component range including QFPs, connectors and tall components.

With placement rates up to 24k components per hour, the MG-1R is fast. Placement accuracy is 50 microns for chips. It handles a wide range of components from 01005 to large connectors (100 x 45mm), fine-pitch and components up to 15mm tall. The MG-1R holds up to 160 twin tapes and 96 single tapes, including stick and tray parts.

Main benefits The standard comes with software and hardware features to improve product quality, increase production efficiency and reduces maintenance, including:

Z-Servo controlled placement heads for accurate stress-free component mounting
Automatic board width and thickness adjustment for fast changeover
Automatic nozzle cleaning station
Automatic temperature feedback to compensate for temperature variations
Fiducial recovery function that eliminates the need to remove and clean the PCB
Feeder indicators that facilitate easy setup and reduce feeder setup

高精密单安置束,带有8个独立的Z -伺服控制头,MG- 1R提供了芯片和IC拍摄之间的完美平衡。它有两个版本:飞行喷嘴变化(FNC)的负责人之一,许多喷嘴需要改变时,产量高是很重要的,其他具有超精细(SF)的使用更广泛的组件范围包括QFPs头,连接器和高大的组成部分。

随着就业率高达每小时24K组件,MG- 1R是很快的。贴装精度为50微米的芯片。它可以处理大范围从01005到大连接器(100 ×45毫米),细间距和组件为15mm高大的组件。 MG- 1R最多可容纳160双磁带和96个单磁带,包括坚持和托盘部分。

该标准的主要优点,附带的软件和硬件功能,以提高产品质量,提高生产效率,并降低了维护,包括:

Z轴伺服控制准确无压力的组成部分贴装头安装
快速更换自动板的宽度和厚度调整
喷嘴自动清洗站
自动温度反馈补偿温度变化
基准点的恢复功能,无需拆除和清理的PCB
直属指标,方便易于安装和减少馈线安装

Specifications
Maximum output per hour 24k
IPC 9850 output per hour 17.4k
Placement accuracy at 3 sigma 50 micron for chips, 30 micron for QFP
Minimum component range 0.4 x 0.2mm (01005)
Maximum component range 100 x 45mm   (3.94 x 1.77")
Maximum component height 15mm (0.60")
Maximum board size (L x W)
Standard: 510 x 440mm  (20 x 17.32")
Optional: 650 x 440mm (25.6 x 17.32")
Minimum board size (L x W) 50 x 50mm  (2 x 2")
Board thickness 0.4 to 4mm   (0.015 to 0.157")
Automatic tool bit exchange nozzles
Tape feeding positions (8mm) 160 twin tapes, 96 single tapes
Feeder options tape, stick, tray, tape strips, re-use, tube, waffle pack
Footprint (L x W) incl. front side feeder trolleys 1650 x 1562mm (64.96 x 61.50")

规格
每小时24K的最大输出
IPC9850输出每小时17.4k
3西格玛50微米芯片的贴装精度,QFP的30微米
最少的元件范围为0.4 ×0.2毫米(01005)
最大组件范围为100 x 45毫米(3.94 x1.77“)
最大元件高度15mm(0.60“)
最大电路板尺寸(长x宽)
标准:510 x440毫米(20 ×17.32“)
可选:650 ×440毫米(25.6 x17.32“)
最小的电路板尺寸(长x宽)50 x 50毫米(2 × 2“)
板厚0.4毫米(0.015到0.157“)
自动换刀位交换喷嘴
磁带喂养的立场(8)160双磁带,96个单磁带
直属磁带选项,棒,托盘,磁带盘,再利用,管,华夫格包
足迹(长x宽),包括。前端馈线手推车1650 x1562毫米(64.96 x61.50“)